|
|
|
|
 |
Memory for New Intel Core i7 Processors and X58 Chipset Connects Directly to Processor
|
|
|
 |
OCZ Technology Group, Inc., a worldwide leader in innovative ultra-high performance and high reliability memory, today announced two new PC2-6400 Titanium Edition dual channel kits.
|
|
|
 |
OCZ Technology Group, the worldwide leader in innovative, ultra-high performance and high reliability memory, today unveiled the next step to achieving maximum performance on the latest PC platforms with the launch of the World's first production PC3-14400 DDR3 modules.
|
|
|
 |
OCZ Technology Group, Inc., a worldwide leader in innovative, ultra-high performance and high reliability memory, today announces two new 1600MHz parts including the world's first enhanced bandwidth high speed DDR3. The newest additions to the OCZ DDR3 family offer enthusiasts performance they can really sink their teeth into and feature blazing fast speeds of 1600MHz and the incredibly fast latencies of 7-7-7 and 7-6-6 on ASUS motherboards.
|
|
|
 |
Super Talent Technology, a leading manufacturer of DRAM memory modules and flash storage solutions, today launched three significant new DDR3 kits.
|
|
|
|
OCZ Technology Group, a worldwide leader in innovative, ultra-high performance and high reliability memory, today announced the newest OCZ DDR3 product addition.
|
|
|
|
OCZ Technology Group, revealed the PC2-6400 Platinum Vista Performance Edition 4GB (2x2048MB) dual channel kit. These new modules feature enhanced timings and are the ultimate upgrade for gamers transitioning their high-performance systems to Windows Vista.
|
|
|
 |
Samsung Electronics Co., Ltd., announced that it has developed the industry's first one gigabit (Gb) Mobile DRAM (dynamic random access memory) for mobile products, using 80nm process technology.
|
|
|
|
|
