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Toshiba Corporation and SanDisk® today announced that they have signed a non-binding memorandum of understanding to form a new production joint venture and construct a new 300 millimeter (mm) wafer fab in Japan
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Nortel and Toshiba Corporation today announced an agreement for the joint development of mobile WiMAX base stations for Japanese and global markets. The base stations will be based on Nortel's next-generation broadband wireless technology and Toshiba's high-efficiency amplifier and miniaturization technology.
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